GSS EU Science Funding Gateway

The performance of such a system will not only depend on the performance of the single chips used for each component but also on the quality and efficiency of their integration into packages and the optimization of their interplay with respect to the targeted application. Advanced packaging technologies are key to obtain compact, robust and reliable electronic components by integrating and encapsulating multiple electronic chips. The resulting Multi-Chip Modules and/or System in Packages (SiP) can provide high performance and multiple functions. Packaging with short interconnections between components minimizes parasitic elements that degrade signal integrity. This is particularly relevant for next generation radio-frequency application (e.g., radars or electronic warfare systems). Furthermore, an advanced density of integration allows hiding sensitive signals and integrating protection features, which is relevant for anti-tamper and secure module solutions.

Packaging technologies can also increase the resilience of supply in key technology areas, reducing dependence and improve security of information by allowing the use of components of different technologies and from different sources within a quality and security assured process. This is particularly relevant for defence applications for which securing the EU supply chains of critical electronic components is challenging due to small manufacturing volumes and potential constraints such as export restrictions.