GSS EU Science Funding Gateway

Proposals will focus on activities related to:

• Development of beyond state-of-the-art processes for electronic components and systems by making use of different types of substrates (e.g. flexible, stretchable and conformable) and their integration in various structures and materials (e.g. textiles, plastics, glass, paper and metal). Proposals should address the improvement of system characteristics (e.g. performance, robustness, reliability) and progress in high throughput and low-cost manufacturing processes.
• Increasing capability to integrate flexible and printed electronics in various application domains (e.g. wearables, mobility, health/well-being, agriculture and environment, energy and smart logistics) including in hybrid IC or flexible systems.
• Activities related to the development of new methodologies for next generation components and systems taking into account Eco-design principles, such as more efficient recovery and recycling solutions or/and optimisation of the use of resources (e.g. energy efficiency at system and manufacturing level, material consumption) will be encouraged.

Issues related to life cycle, end-of life, standardisation, certification and regulation compliance should be considered whenever appropriate. Proposals should include targets and metrics for decreasing use of resources in their chosen approaches.